LTN20069
HEAT SINK BGA/PGA 16.5X16.5X8.9
Preisstaffeln
- Verpackungseinheit: 1, 1,14 € net
Technische Daten
| Type | Board Level |
|---|---|
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Shape | Square, Fins |
| Length | 0.650" (16.51mm) |
| Width | 0.653" (16.59mm) |
| Fin Height | 0.350" (8.89mm) |
| Thermal Resistance @ Forced Air Flow | 8.00°C/W @ 500 LFM |
| Material | Aluminum |
| Material Finish | Black Anodized |