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TS391LT

Chip Quik Inc.

THERMALLY STABLE SOLDER PASTE NO

Price breaks

  • package multiple: 1, €12.33 net

Parameters

TypeSolder Paste
CompositionBi57.6Sn42Ag0.4 (57.6/42/0.4)
Melting Point281°F (138°C)
Flux TypeNo-Clean
Mesh Type4
ProcessLead Free
FormSyringe, 0.53 oz (15g), 5cc
Shelf Life12 Months
Shelf Life StartDate of Manufacture
Storage/Refrigeration Temperature68°F ~ 77°F (20°C ~ 25°C)