TS391SNL50
THERMALLY STABLE SOLDER PASTE NO
Price breaks
- package multiple: 1, €13.32 net
Parameters
| Type | Solder Paste |
|---|---|
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Flux Type | No-Clean |
| Mesh Type | 4 |
| Process | Lead Free |
| Form | Jar, 1.76 oz (50g) |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |