Kühlkörper
Kühlkörper: elektronische Bauteile für Geschäftskunden. Preise in EUR.
122575 Produkte
Produkte
| 507302B00000G | Boyd Laconia, LLC | HEATSINK TO-220 2.5W LOW PROFILE | 0,25 € |
| V7236B1 | Assmann WSW Components | HEATSINK TO-220 19.05X13.21MM | 0,31 € |
| V2016B | Assmann WSW Components | HEATSINK CPU XCUT | 0,36 € |
| 577202B00000G | Boyd Laconia, LLC | HEAT SINK TO-220 .500" COMPACT | 0,41 € |
| V-1100-SMD/B-L | Assmann WSW Components | HEAT SINK COPPER DPAK TO-252 | 0,42 € |
| V-1100-SMD/A-L | Assmann WSW Components | HEATSINK TO-263 12.70X26.20MM | 0,43 € |
| V2017B | Assmann WSW Components | HEATSINK ANOD ALUM CPU | 0,49 € |
| 217-36CTRE6 | Wakefield Thermal Solutions | BOARD LEVEL HEAT SINKS | 0,40 € |
| V6560W | Assmann WSW Components | HEATSINK ALUM ANOD | 0,51 € |
| V-1100-SMD/B | Assmann WSW Components | HEAT SINK COPPER DPAK TO-252 | 0,40 € |
| 576802B04000G | Boyd Laconia, LLC | HEAT SINK VERT PLUG-IN TO-220 | 0,70 € |
| 110991327 | Seeed Technology Co., Ltd | HEAT SINK KIT FOR RASPBERRY PI 4 | 0,72 € |
| 577102B00000G | Boyd Laconia, LLC | HEAT SINK TO-220 .375" COMPACT | 0,78 € |
| 375424B00034G | Boyd Laconia, LLC | HEATSINK PIN-FIN W/TAPE | 0,94 € |
| HSB05-171711 | Same Sky (Formerly CUI Devices) | HEAT SINK, BGA, 17 X 17 X 11.5 M | 0,94 € |
| 577002B00000G | Boyd Laconia, LLC | HEAT SINK TO-220 .250" COMPACT | 0,96 € |
| XL25W-12-12-10 | t-Global Technology | CERAMIC HEAT SINK 12X12X10MM WHI | 1,02 € |
| 3083 | Adafruit Industries LLC | ALUM HEAT SINK FOR RASPBERRY PI | 1,09 € |
| LTN20069 | Wakefield Thermal Solutions | HEAT SINK BGA/PGA 16.5X16.5X8.9 | 1,14 € |
| 658-60AB | Wakefield Thermal Solutions | HEATSINK CPU 28MM SQ BLK W/OTAPE | 1,20 € |